JPH0445271Y2 - - Google Patents
Info
- Publication number
- JPH0445271Y2 JPH0445271Y2 JP19517787U JP19517787U JPH0445271Y2 JP H0445271 Y2 JPH0445271 Y2 JP H0445271Y2 JP 19517787 U JP19517787 U JP 19517787U JP 19517787 U JP19517787 U JP 19517787U JP H0445271 Y2 JPH0445271 Y2 JP H0445271Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- conductive paste
- hole
- foil layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011888 foil Substances 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 21
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- 239000005751 Copper oxide Substances 0.000 description 3
- 230000000740 bleeding effect Effects 0.000 description 3
- 229910000431 copper oxide Inorganic materials 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19517787U JPH0445271Y2 (en]) | 1987-12-22 | 1987-12-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19517787U JPH0445271Y2 (en]) | 1987-12-22 | 1987-12-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0197580U JPH0197580U (en]) | 1989-06-29 |
JPH0445271Y2 true JPH0445271Y2 (en]) | 1992-10-23 |
Family
ID=31485868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19517787U Expired JPH0445271Y2 (en]) | 1987-12-22 | 1987-12-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0445271Y2 (en]) |
-
1987
- 1987-12-22 JP JP19517787U patent/JPH0445271Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPH0197580U (en]) | 1989-06-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0445271Y2 (en]) | ||
US5132864A (en) | Printed circuit board | |
JPH021915Y2 (en]) | ||
US6693243B1 (en) | Surface mounting component and mounted structure of surface mounting component | |
JPH0832195A (ja) | 複合プリント基板の接続構造 | |
JPS629755Y2 (en]) | ||
JPH0436147Y2 (en]) | ||
JPH021778Y2 (en]) | ||
JPH0631737Y2 (ja) | プリント基板 | |
JPH0140204Y2 (en]) | ||
JPS6310593Y2 (en]) | ||
JPS63283051A (ja) | 混成集積回路装置用基板 | |
JPH06314873A (ja) | プリント配線板 | |
JP3151897B2 (ja) | 同軸マイクロストリップライン変換器 | |
JPH0419823Y2 (en]) | ||
JP2868475B2 (ja) | プリント基板 | |
JP2603863B2 (ja) | プリント配線板 | |
JPS6130307Y2 (en]) | ||
JP2810878B2 (ja) | プリント基板 | |
JPH0629640A (ja) | 円筒形チップ部品の取付け構造 | |
JPH051065Y2 (en]) | ||
JPS5927622Y2 (ja) | 印刷配線基板 | |
JPH06232526A (ja) | キー接点を有するプリント配線板 | |
JPS6096868U (ja) | プリント配線板 | |
JPH055765A (ja) | 印刷配線板の印刷有無検出法 |